'Phononic' Uses Thermoelectric Devices to Efficiently Move Heat
Colin Smith — October 26, 2023 — Tech
References: phononic
The 'Hex 2.0' CPU cooler from Phononic uses a solid-state thermoelectric module and a thermally-conductive heatsink to efficiently dissipate heat from a processor. The Hex 2.0 is compatible with Intel processors at this time, and can technically be used with AMD processors, but it is not rated for efficiency with AMD processors.
This solid-state thermoelectric cooler is easy to install and maintain due to its lack of moving parts. The cooler does not require a cooling fan or any liquid compound. However, its performance is dramatically increased when attaching a cooling fan, though this is not necessarily required for low-power processors, making this a reliable and cost-effective choice for compact low-power computing setups. According to Phononic, when paired with a cooling fan, the Hex 2.0 delivers far improved cooling efficiency when compared even to larger coolers due to the high thermal transfer rate from its solid-state module.
Image Credit: Phononic
This solid-state thermoelectric cooler is easy to install and maintain due to its lack of moving parts. The cooler does not require a cooling fan or any liquid compound. However, its performance is dramatically increased when attaching a cooling fan, though this is not necessarily required for low-power processors, making this a reliable and cost-effective choice for compact low-power computing setups. According to Phononic, when paired with a cooling fan, the Hex 2.0 delivers far improved cooling efficiency when compared even to larger coolers due to the high thermal transfer rate from its solid-state module.
Image Credit: Phononic
Trend Themes
1. Solid-state Heat Dissipation - The use of solid-state thermoelectric modules in heat dissipation units is a disruptive innovation opportunity, providing efficient and reliable cooling solutions without the need for moving parts or liquid compounds.
2. Compact Low-power Computing - The development of compact low-power computing setups that can effectively dissipate heat using solid-state CPU coolers presents a disruptive innovation opportunity for the tech industry.
3. Efficient Cooling Solutions - The integration of cooling fans with solid-state thermoelectric coolers offers an opportunity for disruptive innovation in the field of heat dissipation, providing improved cooling efficiency even in smaller form factors.
Industry Implications
1. Technology - The technology industry could benefit from utilizing solid-state thermoelectric modules in heat dissipation units to enhance the cooling efficiency of computer processors.
2. Electronics - The electronics industry has an opportunity to develop compact and efficient cooling solutions for low-power computing setups using solid-state CPU coolers.
3. Manufacturing - The manufacturing industry can explore the production of solid-state heat dissipation units that integrate cooling fans, offering improved cooling efficiency for various applications.
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