Sigray's Apex-Hybrid Targets Failure Analysis in Engineering
References: finance.yahoo
Sigray has introduced the Apex-Hybrid, an advanced 3D X-ray microscopy system designed to revolutionize failure analysis and reverse engineering in semiconductor and electronics industries. The system combines two imaging modalities — laminography for large-scale samples like wafers and printed circuit boards, and tomography for high-resolution inspection of smaller components — into a single platform capable of 350nm spatial resolution. The dual functionality of Singray's Apex-Hybrid addresses critical industry challenges, including artifact reduction in traditional computed tomography and improved defect detection in advanced packaging architectures like chiplets and through-silicon vias.
The advanced 3D X-ray microscopy system improves user outcomes and efficiency through its rapid scan times, automated batch processing for up to ten samples, and a long-lifetime X-ray source designed to reduce operational costs. Early adoption by academic institutions, such as the University of Florida’s SCAN Lab, highlights its potential for applications ranging from counterfeit electronics detection to AI-assisted hardware security analysis.
Image Credit: Sigray
The advanced 3D X-ray microscopy system improves user outcomes and efficiency through its rapid scan times, automated batch processing for up to ten samples, and a long-lifetime X-ray source designed to reduce operational costs. Early adoption by academic institutions, such as the University of Florida’s SCAN Lab, highlights its potential for applications ranging from counterfeit electronics detection to AI-assisted hardware security analysis.
Image Credit: Sigray
Trend Themes
1. Hybrid Imaging Technologies - Integrating laminography and tomography in a single platform enables comprehensive failure analysis and defect detection, offering a new standard in imaging modalities.
2. Automated Batch Processing - The capability to process multiple samples simultaneously can significantly enhance throughput and efficiency in industrial and academic settings.
3. AI-assisted Hardware Security - Leveraging AI for real-time analysis in hardware examination promises advanced security solutions against counterfeiting.
Industry Implications
1. Semiconductor Manufacturing - Enhanced defect detection and reverse engineering techniques play a crucial role in advancing chip production methodologies and quality assurance.
2. Electronics Quality Control - Cutting-edge 3D X-ray systems offer unprecedented detail in component inspection, improving quality control processes for electronic devices.
3. Academic Research - The utilization of advanced imaging technologies in universities fosters innovation and aids in the development of next-generation electronic components.
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