CoolIt's Latest Cold Plate Dissipates Up to 400W of Heat
Colin Smith — March 18, 2025 — Tech
References: coolitsystems & kitguru.net
CoolIT Systems has introduced a new 4000W cold plate, designed to advance single-phase direct liquid cooling (DLC) technology. This cold plate is capable of dissipating up to 4000 watts of heat, more than doubling the previously accepted limits of single-phase DLC solutions. It utilizes water or a water-glycol mixture to remove heat from semiconductors, achieving over 97% heat capture efficiency during testing. The cold plate also features an ultra-low thermal resistance of less than 0.009°C/W and a full flow loop pressure drop of just 8 PSI, ensuring high thermal performance and energy efficiency. These advancements position the cold plate as a reliable solution for cooling ultra-high-wattage processors, such as those used in AI and high-performance computing.
The 4000W cold plate incorporates CoolIT's Split-Flow technology, which enhances thermal and flow performance by 30% compared to standard cold plates. This technology also enables targeted cooling for hotspots, making it suitable for next-generation processors with high thermal design power (TDP). CoolIT's innovation aligns with the growing demand for efficient cooling solutions in data centers and other high-performance environments. By addressing the challenges of heat dissipation in advanced computing systems, the 4000W cold plate demonstrates CoolIT's leadership in liquid cooling technology and its commitment to supporting the evolving needs of the semiconductor industry.
Image Credit: CoolIt Systems
The 4000W cold plate incorporates CoolIT's Split-Flow technology, which enhances thermal and flow performance by 30% compared to standard cold plates. This technology also enables targeted cooling for hotspots, making it suitable for next-generation processors with high thermal design power (TDP). CoolIT's innovation aligns with the growing demand for efficient cooling solutions in data centers and other high-performance environments. By addressing the challenges of heat dissipation in advanced computing systems, the 4000W cold plate demonstrates CoolIT's leadership in liquid cooling technology and its commitment to supporting the evolving needs of the semiconductor industry.
Image Credit: CoolIt Systems
Trend Themes
1. Advanced Single-phase Liquid Cooling - The evolution of single-phase liquid cooling presents opportunities to redefine thermal management solutions for high-performance systems by significantly increasing heat dissipation capabilities.
2. Targeted Hotspot Cooling - Innovations in targeted cooling for processing hotspots offer the potential to enhance efficiency and longevity of next-generation processors, directly addressing TDP challenges.
3. Energy-efficient Heat Dissipation - The push towards extremely energy-efficient heat dissipation in liquid cooling systems creates avenues for reducing energy costs in data centers and similar high-demand environments.
Industry Implications
1. Semiconductor Manufacturing - The semiconductor manufacturing industry can greatly benefit from advanced cooling technologies, enabling more powerful chips to operate within safe thermal limits.
2. Data Center Operations - As computing demands rise, the need for innovative cooling solutions in data center operations could significantly mitigate energy consumption and enhance sustainability.
3. High-performance Computing - The high-performance computing industry faces a transformation opportunity with liquid cooling solutions that effectively manage heat in ultra-high-wattage processors.
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